Shine By Strength.

Process upgrade of the whole series of products

Non destructive cutting technology

Using low-temperature laser technology combined with the principle of thermal expansion and cold contraction large silicon wafers are naturally separated by thermal stress
The cutting surface is very smooth without any microcracks
The mechanical strength is equivalent to the overall strength of the battery which is much higher than the traditional cut battery

Multi main grid technology

Adopting a thinner and narrower main grid design can increase
the output power of photovoltaic modules by 2% Has become
the mainstream of the industry, significantly reducing the power
loss of current transmission So that the module has higher light
utilization and better crack resistance

Multi main grid technology

Multi main grid technology Adopting a thinner and narrower main grid design can increase the output power of photovoltaic modules by 2% Has become the mainstream of the industry, significantly reducing the power loss of current transmission So that the module has higher light utilization and better crack resistance

25 year power warranty

≤2%

First year attenuation

≤0.55%

Linear attenuation

0-3% positive tolerance
Strict quality control
Excellent anti PID characteristics
Lower kwh cost
Fusion half chip multi main grid technology
Excellent low light performance
0-3% positive tolerance
Strict quality control
Excellent anti PID characteristics
Lower kwh cost
Fusion half chip multi main grid technology
Excellent low light performance